Raise3D runs the Open Software Program

Raise3D has announced the launch of the Open Software Program (OSP) – a program aimed at facilitating the cooperation of software companies with Raise3D. In November 2017, the company launched the Open Filament Program (OFP) – an initiative that has enabled cooperation with 42 of the most important filament manufacturers on the market and led to the approval and release of 172 filaments in five years. OFP continues to be a strategic pillar of Raise3D, with dozens of new filaments in the pipeline.

Five years after the successful launch of OFP, Raise3D is taking another step towards improving its customer experience with the launch of OSP. Similar to the concept of OFP, in OSP Raise3D invites developers of the best software solutions to work with Raise3D to improve the experience of their customers.

Currently, four software companies are already cooperating in the period before the launch of the TSO. Raise3D now invites software companies to contact the TSO manager for additional information and possible cooperation.

Source: Raise3D press materials