Spectrum Filaments has developed with its business partners an innovative and innovative series of ceramic materials for 3D printing in FDM / FFF technology! Four specialized filaments are the first commercial solution of this type on the market, allowing for 3D printing of ceramic applications using typical desktop 3D printers.
3D printing of ceramic materials in FDM / FFF technology is a new technology of additive molding of ceramic elements that will find application mainly in the sphere of prototype production and small production series of details with complex geometries that cannot be produced using other manufacturing techniques. After the model is formed by the 3D printer, the details require appropriate post-processing, which includes loosening and sintering.
Spectrum ceramic filaments are based on polyamide, which distinguishes them from other, related materials for 3D printing in the form of wire, using metal, which are based, for example, on relatively toxic POM. Details print at very low temperatures, at 150-160°C with a work table temperature of 40-50°C.
After finishing the work, the detail can be subjected to a typical treatment in the form of removal of support structures, surface grinding (which becomes shiny), or drilling. Then carry out the so-called loosening, i.e. removing binding agents. Depending on the type of ceramics contained in the filament, it can have a different form – e.g. bathing in a dedicated, commonly available chemical agent (e.g. acetone). The last element of processing is baking in the oven.
All 3D models that will be presented next week at Formnext 2019 were made on a BCN3D Sigma 3D printer, which confirms that they are perfect for the desktop environment.
The new Spectrum ceramic filaments are based on the most common materials from modern ceramics:
SSiC Silicon Carbide
Extremely hard, with excellent corrosion resistance over the entire pH range. The temperature resistance of manufactured elements is 1500°C. SSiC is an electric semiconductor. Its compressive strength is 4000 MPa.
Si3N4 Silicon Nitride
It has higher strength and brittle fracture resistance than SSiC. It has a very low coefficient of linear thermal expansion, which results in a very high resistance to thermal shocks. It is an electrical insulator and its thermal conductivity is 30 W / mK. The maximum working temperature of manufactured elements is in the range from 1300°C to 1400°C.
It has less strength than SSiC and Si3N4. It is an electrical insulator and a relatively good heat conductor (approx. 20-30 W / mK). It has very good corrosion resistance in the acid range (pH <7), with low resistance in the alkaline range (pH> 7).
High strength at room temperature and very high resistance to brittle cracking. Thanks to the high coefficient of linear thermal expansion (10 * 10-6K-1), ZrO2 can be bonded to stainless steel without any problems. Corrosion resistance in the pH range <7 is good and in the pH range> 7 insufficient.